SAN JOSE, Calif., Oct. 9 CA-Ultratech-Acquires
SAN JOSE, Calif., Oct. 9 /PRNewswire-FirstCall/ -- Ultratech, Inc.
(Nasdaq: UTEK), a leading supplier of lithography and laser-processing systems
used to manufacture semiconductor devices, today announced that it has
acquired the rights to a collection of patents from IBM -- these include
fundamental patents around the area of rapid thermal annealing. Representing
both U.S. and foreign patents, the portfolio includes hardware for thermal
processing (annealing) of semiconductor wafers, as well as patents for
temperature control and metrology. This acquisition strengthens and broadens
Ultratech's annealing technology capability for ultra-shallow junction (USJ)
formation -- a critical step in semiconductor manufacturing.
"Ultratech has periodically purchased patents that it views are key to our
business," noted Ultratech Chairman and CEO Arthur W. Zafiropoulo. "The
acquisition of these patents from IBM is the continuation of that strategy to
ensure that our customers receive the highest technology content in their
products. This acquisition reinforces our commitment to remain at the
forefront of providing equipment with leading-edge technology and low
cost-of-ownership advantages for our global customer base."
Certain of the statements contained herein, which are not historical facts
and which can generally be identified by words such as "anticipates,"
"expects," "intends," "will," "could," "believes," "estimates," "continue,"
and similar expressions, are forward-looking statements under Section 27A of
the Securities Act of 1933, as amended, and Section 21E of the Securities
Exchange Act of 1934, as amended, that involve risks and uncertainties, such
as risks related to our dependence on new product introductions and market
acceptance of new products and enhanced versions of our existing products;
lengthy sales cycles, including the timing of system installations and
acceptances; lengthy and costly development cycles for laser-processing and
lithography technologies and applications; integration, development and
associated expenses of the laser processing operation; delays, deferrals and
cancellations of orders by customers; cyclicality in the semiconductor and
nanotechnology industries; general economic and financial market conditions
including impact on capital spending; pricing pressures and product discounts;
high degree of industry competition; intellectual property matters; changes to
financial accounting standards; changes in pricing by us, our competitors or
suppliers; customer concentration; international sales; timing of new product
announcements and releases by us or our competitors; ability to volume produce
systems and meet customer requirements; sole or limited sources of supply;
ability and resulting costs to attract or retain sufficient personnel to
achieve our targets for a particular period; dilutive effect of employee stock
option grants on net income per share, which is largely dependent upon us
achieving and maintaining profitability and the market price of our stock; mix
of products sold; rapid technological change and the importance of timely
product introductions; outcome of litigation; manufacturing variances and
production levels; timing and degree of success of technologies licensed to
outside parties; product concentration and lack of product revenue
diversification; inventory obsolescence; asset impairment; effects of certain
anti-takeover provisions; future acquisitions; volatility of stock price;
foreign government regulations and restrictions; business interruptions due to
natural disasters or utility failures; environmental regulations; and any
adverse effects of terrorist attacks in the United States or elsewhere, or
government responses thereto, or military actions in Iraq, Afghanistan and
elsewhere, on the economy, in general, or on our business in particular. Such
risks and uncertainties are described in Ultratech's SEC reports including its
Annual Report on Form 10-K filed for the year ended December 31, 2007 and
Quarterly Report on Form 10Q for the quarter ended June 28, 2008. Due to these
and additional factors, the statements, historical results and percentage
relationships set forth herein are not necessarily indicative of the results
of operations for any future period. These forward-looking statements are
based on management's current beliefs and expectations, some or all of which
may prove to be inaccurate, and which may change. We undertake no obligation
to revise or update any forward-looking statements to affect any event or
circumstance that may arise after the date of this release.
About Ultratech: Ultratech, Inc. (NASDAQ: UTEK) designs, manufactures and
markets photolithography and laser processing equipment. Founded in 1979,
Ultratech is a market leader in gold and solder bump lithography, in addition
to being a pioneer of laser processing. Its advanced-packaging lithography
systems deliver strong cost-of-ownership, repeatability and throughput
advantages, and are widely used worldwide in the fabrication of semiconductors
and FPDs. Ultratech's advanced laser processing technology is designed to
enhance yields, while enabling a cost-effective transfer to 65-nm and below
production, and is being integrated into the manufacturing lines of leading-
edge semiconductor manufacturers. Ultratech's home page on the World Wide Web
is located at http://www.ultratech.com.
(UTEK-G)
SOURCE Ultratech, Inc.
