HILLSBORO, OR -- 10/27/09 --
NexPlanar, the semiconductor CMP pad
technology company, has introduced the Element™ family of CMP pads designed
to deliver high removal rates, excellent planarization and exceptionally
low defectivity. NexPlanar utilized its newly developed hybrid polymer
technology in concert with patented in-situ molded groove technology to
produce a new line of hard and semi-hard pads that provide a level of
defectivity performance not available with industry-standard products.
The new line of pads is available with various groove types and groove
depths, including NexPlanar's proprietary "S-Groove" design, to provide
excellent uniformity, pad life and low cost-of-ownership.
Defectivity Reduction
The Element™ line combines the removal rate and planarization benefits
generally associated with hard pads with the lower defectivity levels of
softer pads. Customers now sampling the Element line have confirmed the
high removal rates, excellent planarization and in some cases, defectivity
levels at one-tenth the levels observed on traditional hard pads.
While the pads will be typically sold in standard configurations, NexPlanar
is able to modulate pad properties, such as pad hardness, pore size and
pore density, to develop customized solutions for demanding applications
and integration schemes, including those for emerging technologies.
"We work in a relatively conservative industry when it comes to change,"
commented Jim LaCasse, NexPlanar president and CEO. "However, the
semiconductor industry continues to need lower defectivity and lower
cost-of-ownership products in both mature and advanced manufacturing
operations. We at NexPlanar are especially pleased with the response to
our Element product line, which enables our customers to convert from
industry standard hard pads with little or no change to their tool settings
or related consumables, such as conditioner disks. As a result they can
reduce their costs and improve yields with minimal expenditure of
resources."
The Element pads are now available for sampling and the product line will
be commercially available worldwide for a variety of applications in late
Q4 2009.
About NexPlanar Corporation
NexPlanar builds the next generation of chemical mechanical planarization
(CMP) pads for the semiconductor device industry. NexPlanar uses
proprietary "nano-domain" technology which improves planarity and across
wafer uniformity and can be utilized to customize the CMP pads for specific
applications. NexPlanar's "nano-lubricants" and patented molded groove
technologies allow for low stress CMP (required for the most advanced CMP
applications), result in an order of magnitude fewer defects, low slurry
consumption processing and lower overall cost of ownership. See
www.nexplanar.com.
Company Contact:
Haluk Oran
480.539.6889
Email Contact
Agency Contact:
Bruce Kirkpatrick
Kirkpatrick Communications
925.244.9100
Email Contact
