SAN DIEGO, Sept. 8 CA-Rayspan-Antennas
SAN DIEGO, Sept. 8 /PRNewswire/ -- Rayspan Corporation, the world's
leading innovator of metamaterial air interface solutions, is proud to
announce that in the first three quarters of 2008 licensees of its
technologies have shipped more than 800,000 devices equipped with a total of
more than five million metamaterial antennas. The applications supported by
these advanced wireless communications products include WiFi wireless LANs,
laptop PCs, and cellular phones.
Franz Birkner, Rayspan President and CEO, stated that "This rapid growth
to extremely high volumes across a broad range of markets establishes the
technical and commercial superiority of Rayspan and its unique metamaterial
air interface solutions. We are today the only company in the world to have
successfully developed and commercialized metamaterials technology for
wireless communications, and we intend to maintain this leadership through
advanced research and development, constant product innovation and aggressive
first-to-market capabilities. Going forward, we will broaden our array of
solutions to include not only antennas but also entire RF front-ends offering
true superiority in miniaturization, cost effectiveness and performance
improvement."
Since its founding in April 2006, Rayspan has focused on innovating and
implementing metamaterials technology to solve the fundamental challenges of
the wireless communications air interface -- an essential part of every radio
that includes the antenna and all associated RF front-end components. As
standards have proliferated to include 3/4G cellular, WiFi MIMO, GPS,
Bluetooth, WiMax and UWB, the air interface now presents some of the most
difficult system integration problems facing the wireless industry. Because
these standards require support of multiple radio bands and multiple channels
within bands, until now the size and spacing requirements of the antennas and
RF components have made it nearly impossible to achieve compact mobile
terminal size while still achieving wireless performance objectives.
Rayspan's metamaterial air interface solutions decisively solve these
problems. They enable ultra-compact, multi-band MIMO wireless terminals with
no sacrifice in performance and with excellent cost-effectiveness. In
virtually all cases metamaterial air interfaces provide equal or better
throughput and efficiency than the conventional air interface components they
replace -- or eliminate -- while offering a much smaller form factor.
Metamaterial solutions available from Rayspan today include a broad line
of single and multi-band antennas and arrays together with complementary
directional couplers, power combiners and power splitters. These solutions
address virtually all segments of the billion unit wireless local- and
wide-area network equipment markets, and they can be implemented quickly and
inexpensively by Rayspan's licensees.
SOURCE Rayspan Corporation
