BRISTOL, Pa., Sept. 5 PA-Aries-Electronics
BRISTOL, Pa., Sept. 5 /PRNewswire/ -- Aries Electronics, an international
manufacturer of standard, programmed and custom interconnection products, has
recently updated its CSP/BGA test and burn-in and RF sockets, including 13 mm
squared, 27 mm squared, 40 mm squared and 55 mm squared models, to accommodate
devices with pitches down to 0.3 mm. With this new pitch capability, Aries'
sockets are suitable for use with an even greater range of CSP, MicroBGA, DSP,
LGA, SRAM, DRAM and Flash devices. In addition, Aries' standard molded socket
format enables each socket to accommodate any device package size indicated by
using machined or custom molded pressure pads or interposers.
Aries' new RF test sockets can be easily mounted to and removed from the
printed circuit board (PCB), and the CSP/BGA test and burn-in sockets can be
conveniently mounted to and removed from the burn-in-board (BIB). The ease of
mount and removal is made possible by the sockets' solderless pressure mount
compression spring probes, which can be accurately located by two molded
plastic alignment pins and mounted with four stainless steel screws.
Aries' new sockets offer gold over nickel plated compression spring
probes, which enable the spring probes to leave very small witness marks on
the bottom surface of the device solder balls. The pressure pad compression
spring also provides proper force against the device, allowing for height
variations in device thickness.
Also included with the CSP/BGA test and burn-in version is a four-point
spring probe crown to insure "scrub" on solder ball oxides. The RF socket
includes "scrub" on solder balls with raised tip probes that provide "scrub"
on pads. Signal path during test is 0.077" [1.96mm].
The sockets accommodate up to 500,000 cycles and operate at temperatures
of -55 degrees Celsius to 150 degrees Celsius (-67 degrees Fahrenheit to 302
degrees Fahrenheit). Both versions are comprised of spring probes with contact
forces of 15 g per contact on 0.30 mm to 0.35 mm pitches, 16 g per contact on
0.40 mm to 0.45 mm pitches, 25 g per contact on 0.50 mm pitches or larger.
Spring probes are heat-treated beryllium copper alloy plated with 30 micron"
min. (0.75 micron) gold per Mil-G-45204 over 30 micron" min. (0.75 µm) nickel
per SAE-AMS-QQ-N-290. The sockets' molded components are UL94V-0 Ultem and
machined components are UL94V-0 PEEK or Torlon. All hardware is stainless
steel.
As with all Aries sockets, the new CSP/BGA test and burn-in and RF socket
versions are available in custom materials, platings, sizes and configurations
to suit specific customer applications.
Pricing for a 100 lead device socket starts at $150.00. Delivery is 20
working days ARO.
For additional information, contact Aries Electronics Inc., 2609 Bartram
Road, Bristol, Pa. 19007-6810; Tel: 215-781-9956; Fax: 215-781-9845; Email:
info@arieselec.com;
Web: www.arieselec.com, Data sheet #23017-
www.arieselec.com/products/23017.pdf.
Europe Email: europe@arieselec.com.
For an electronic copy, please visit
http://www.simongroup.com/PressRoom/WordDocs/ari/ARI-A-7364.doc
For high res photo, please visit
http://www.simongroup.com/PressRoom/Images/aries/ARI-A-7364.jpg
For additional news releases from Aries Electronics, please visit
http://www.simongroup.com/PressRoom/aries.html
SOURCE Aries Electronics
