BOISE, Idaho - (Business Wire) American Semiconductor, Inc. has been selected by Air Force Research Laboratory (AFRL) to develop a deep sub-volt, Ultra Low Power (ULP) CMOS technology that maintains high performance at very low voltages. Flexfet™ ULP will benefit AFRL and other Department of Defense (DoD) agencies by providing foundry access to advanced ULP CMOS technology. “The Ultra Low Power process will be a deep sub-volt version of our Flexfet technology built at 130nm,” said Doug Hackler, President and CEO of American Semiconductor. “Flexfet supports both independently double-gated (IDG) operation for dynamic power control and double-gated operation for near ideal steep sub-threshold slope and higher performance at low voltage. These capabilities are not available in standard CMOS and provide a dramatic improvement in performance over traditional sub-volt design approaches.”
The program’s goal is to develop an Ultra Low Power CMOS technology that allows designers to have low power in both dynamic and static conditions as opposed to today’s CMOS technology that requires a designer to choose between the two. Flexfet is uniquely positioned as the technology to enable ULP. Flexfet is an advanced CMOS process based on the Flexfet MIGFET (Multiple Independent Gate FET) transistor. The novel design of the Flexfet transistor brings many benefits not realized in standard CMOS processes, which enable sub-volt designs and supports continued voltage scaling. Flexfet’s MIGFET architecture implements Dynamic Threshold Control (DTC), enabling Vt to be controlled on-the-fly. Additionally, Flexfet’s unique MIGFET on SOI process creates an inherent radiation tolerance, which is extremely useful in avionics and space systems. Flexfet is commercially available as a foundry process from American Semiconductor with standard Process Development Kits available for 180nm and 130nm nodes.
“With deep sub-volt ULP, battery powered applications can run much longer between recharges and high performance systems generate less heat, reducing or eliminating cooling needs and improving reliability,” said Rich Chaney, General Manager of American Semiconductor. “While improved reliability and extended battery life are critically important to space missions, these ULP benefits can be valuable to other high-reliability and consumer applications.”
“This contract is a significant achievement for Idaho defense industries,” said Rick Ritter, President and CEO of Idaho TechConnect. “American Semiconductor demonstrates the success of small business in Idaho and highlights defense related technologies developed and commercialized in Idaho.”
About American Semiconductor
American Semiconductor, Inc. is a complete silicon fabrication source, providing a complete suite of services to enable product realization from concept to fabrication. As an on-shore, ITAR compliant, pure-play U.S. foundry, American Semiconductor provides services for all aspects of wafer fabrication and process development at low cost for low to mid-volumes. Silicon services include Custom Fabrication for copy smart or copy exact replication, Flex™ Silicon on Polymer technology for flexible CMOS, and Flexfet™ advanced CMOS technology for low-power and radiation hardened applications. American Semiconductor provides Process Design Kits (PDK) based on Simucad software tools. To learn more about American Semiconductor, visit www.americansemi.com.
American Semiconductor Inc., the American Semiconductor logo, Flexfet, FleX, and the Flexfet logo are trademarks of American Semiconductor, Inc. All other trademarks are the property of their respective owners.
American Semiconductor, Inc.
Rich Chaney, 208-336-2773
richchaney@americansemi.com
www.americansemi.com
